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大哥,那是环保法规的结果。 随便去个制造商网站上查一下Pb Free就知道了。https://www.ti.com/support-quality/environmental-info/lead-free.html
Due to worldwide environmental restricted chemical and material (RCM) concerns, it was determined lead (Pb) as one of the major substances of concerns. Lead-free devices in electronic components and systems continues to receive significant attention within the semiconductor and electronics industry as a whole. TI is committed to working with customers to offer products that meet their specific needs in this area.
Small amounts of lead have been commonly used in integrated circuits for many years. During the late 1980s, TI began converting its products to lead-free alternatives. By 1989, TI introduced the Nickel/Palladium (Ni/Pd) finish, as a lead-free alternative to the IC market. By 2000, these products moved to a Nickel/Palladium/Gold (Ni/Pd/Au).
Today TI's lead-free products use Ni/Pd/Au or annealed matte tin (Sn) for leadframe type packages and Tin/Silver/Copper (Sn/Ag/Cu) for ball grid array (BGA) types of products.
TI's remaining products using lead (Pb) are required by customers, such as military and space products or under regulatory exemption (see RoHS Exempt and expiration statement). For more information on specific packages or part numbers visit our Material Content Search Tool. Links to related resources are below.
我大学刚毕业的时候,在深圳一家工厂做研发。08年的时候,很多出货都是采用有铅制程。后来不行了,到10年12年的时候,工厂强制全部改为无铅,理由是客户不允许接受有铅。当时研发这边非常抵触,因为看似简单但是温度提升20-30度,更换焊料实际上需要做非常多的测试的。而且在研发过程中焊接也不允许使用有铅。个别工程师焊接的时候用不好无钱老是把烙铁头烧坏,于是偷偷使用有铅,后来处理问题时把焊锡带到产线上临时焊接忘记带走,员工继续拿来焊接污染了一批货,然后客户检测出来整批货被迫重做。 |
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