PS：因为9025L是低阻管，所以源极也需要更大的焊接面积（用了3条线），降低引线对电阻的影响。作者: 张先生 时间: 2009-5-23 15:02
NXP’s SOT669 LFPAK offers outstanding thermal performance
from the compact footprint of the SO8. It allows heat to
be dissipated more easily, maintaining the lowest possible
operating temperatures. Furthermore, the LFPAK has an
extremely low profi le – at 1.1 mm thick it is 40% thinner
than SO8. And its innovative internal construction enables an
inductance considerably lower than comparable packages.
In a traditional power package the main thermal pathway
is vertically down through the mounting and into the PCB.
However, the LFPAK also dissipates a signifi cant
amount of power upwards through the top of the package,
giving it a thermal resistance signifi cantly lower than SO8 and
comparable with much larger packages such as DPAK.
